Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies

Pao, Yi-Hsin, Lau, John

Dealing with BGA, CSP, flip chips and other new technologies that underlie the electronics industry's need for smaller, faster products, this text explains the fundamentals of solder joint reliability and presents creative, robust packaging techniques for cost-effective interconnection.

EAN

9780070366480

Publisher

McGraw-Hill Professional

Published

31 December 1996

Pages

408